News Highlights
- AMD provided an early look at its “Helios” rack-scale platform, the blueprint for yotta-scale AI infrastructure, built on AMD Instinct MI455X GPUs and AMD EPYC “Venice” CPUs designed for advanced AI workloads
- AMD expanded its AI portfolio with the introduction of the AMD Instinct MI440X GPU for enterprise deployments and previewed the next-generation Instinct MI500 Series GPUs
- Launched new AMD Ryzen AI platforms for AI PCs and embedded applications; unveiled the Ryzen AI Halo developer platform
- Announced a commitment of $150 million to bring AI into more classrooms and communities
LAS VEGAS, Jan. 05, 2026 (GLOBE NEWSWIRE) — Today at CES 2026, AMD (NASDAQ: AMD) Chair and CEO Dr. Lisa Su detailed in the show’s opening keynote how the company’s extensive portfolio of AI products and deep cross-industry collaborations are turning the promise of AI into real-world impact.
The keynote showcased major advancements from the data center to the edge, with partners including OpenAI, Luma AI, Liquid AI, World Labs, Blue Origin, Generative Bionics, AstraZeneca, Absci and Illumina detailing how they are using AMD technology to power AI breakthroughs.
“At CES, our partners joined us to show what’s possible when the industry comes together to bring AI everywhere, for everyone,” said Dr. Lisa Su, chair and CEO of AMD. “As AI adoption accelerates, we are entering the era of yotta-scale computing, driven by unprecedented growth in both training and inference. AMD is building the compute foundation for this next phase of AI through end-to-end technology leadership, open platforms, and deep co-innovation with partners across the ecosystem.”
The blueprint for yotta-scale compute
Compute infrastructure is the foundation of AI, and accelerating adoption is driving an unprecedented expansion from today’s 100 zettaflops of global compute capacity to a projected 10+ yottaflops in the next five years. Building AI infrastructure at yotta-scale will require more than raw performance; it demands an open, modular rack design that can evolve across product generations, combining leadership compute engines with high-speed networking to connect thousands of accelerators into a single, unified system.
The AMD “Helios” rack-scale platform is the blueprint for yotta-scale infrastructure, delivering up to 3 AI exaflops of performance in a single rack. It’s designed to deliver maximum bandwidth and energy efficiency for trillion-parameter training. “Helios” is powered by AMD Instinct™ MI455X accelerators, AMD EPYC™ “Venice” CPUs and AMD Pensando™ “Vulcano” NICs for scale-out networking, all unified through the open AMD ROCm™ software ecosystem.
At CES, AMD provided an early look at “Helios” and, for the first time unveiled the full AMD Instinct MI400 Series accelerator product portfolio while previewing the next-generation MI500 Series GPUs.
The latest addition to the MI400 Series is the AMD Instinct MI440X GPU, designed for on-premises enterprise AI deployments. The MI440X will power scalable training, fine-tuning and inference workloads in a compact, eight-GPU form factor that integrates seamlessly into existing infrastructure.
The MI440X builds on the recently announced AMD Instinct MI430X GPUs, which are designed to deliver leadership performance and hybrid computing for high-precision scientific, HPC and sovereign AI workloads. MI430X GPUs will power AI factory supercomputers around the world, including Discovery at Oak Ridge National Laboratory and the Alice Recoque system, France’s first exascale supercomputer.
AMD shared additional details at CES on the next-generation AMD Instinct MI500 GPUs, planned to launch in 2027. The MI500 Series is on track to deliver up to a 1,000x increase in AI performance compared to the AMD Instinct MI300X GPUs introduced in 20231. Built on next-generation AMD CDNA™ 6 architecture, advanced 2nm process technology and cutting-edge HBM4E memory, MI500 GPUs will deliver leadership at every level.
Enabling AI PC experiences everywhere
AI is becoming a foundational part of the PC experience, where billions of users will interact directly with AI, both locally on the device and through the cloud. At CES, AMD introduced new products that expand AMD’s AI PC portfolio and deepen developer support across the ecosystem.
The next-generation AMD Ryzen™ AI 400 Series and Ryzen AI PRO 400 Series platforms deliver a 60 TOPS NPU2, cutting-edge efficiency and full AMD ROCm platform support for seamless cloud-to-client AI scaling. First systems ship in January 2026, with broader OEM availability in Q1 2026.
AMD also expanded its breakthrough on-device AI compute offerings with Ryzen AI Max+ 392 and Ryzen AI Max+ 388 which supports models of up to 128-billion-parameters with 128GB unified memory. These platforms enable advanced local inference, content creation workflows and incredible gaming experiences in premium thin-and-light notebooks and small form factor (SFF) desktops.
For developers, the Ryzen AI Halo Developer Platform brings powerful AI development capabilities to a compact SFF desktop PC, delivering leadership tokens-per-second-per-dollar with high-performance Ryzen AI Max+ Series processors. Ryzen AI Halo is expected to be available in Q2 2026.
AI transforming the physical world
AMD introduced the Ryzen AI Embedded processors, a new portfolio of embedded x86 processors designed to power AI-driven applications at the edge. From automotive digital cockpits and smart healthcare to physical AI for autonomous systems, including humanoid robotics, the new P100 and X100 Series processors deliver high performance, efficient AI compute for the most constrained embedded systems.
Advancing the Genesis Mission and the future of AI innovation
Lisa Su was joined on stage by Michael Kratsios, Director of the White House Office of Science and Technology Policy, to discuss the role AMD has in the U.S. government’s Genesis Mission. This ambitious public/private technology initiative aims to secure U.S. leadership in AI technologies and shape scientific discovery and global competitiveness for years to come. Genesis includes two recently announced AMD-powered AI supercomputers at Oak Ridge National Laboratory, Lux and Discovery.
Mr. Kratsios also highlighted the White House’s efforts to rally organizations to pledge resources toward expanding access to AI education with more hands-on opportunities for students to learn and build. In joining the pledge, AMD announced its commitment of $150 million to bring AI into more classrooms and communities.
The keynote concluded with recognition of the more than 15,000 student innovators who participated in the AMD AI Robotics Hackathon in partnership with Hack Club.
Supporting Resources
About AMD
AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world’s most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing. Learn more at www.amd.com.
Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD “Helios” rack-scale platform, AMD Instinct™ MI400 Series, AMD Instinct™ MI500 Series, AMD Ryzen™ AI 400 Series, AMD Ryzen™ AI PRO 400 Series, AMD Ryzen™ AI Max+ 392, AMD Ryzen™ AI Max+388, AMD Ryzen™ AI Halo Developer Platform, AMD Ryzen™ AI Embedded P100 Series, and AMD Ryzen™ AI Embedded X100 Series processors; expected benefits from ecosystem partner collaboration; expected future AI demand; and AMD’s role in and the expected benefits from the Genesis Mission, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and are generally beyond AMD’s control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD’s ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD’s products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD’s ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD’s reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD’s reliance on Microsoft and other software vendors’ support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD’s supply chain; AMD’s ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, import tariffs, trade protection measures and licensing requirements; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or strategic investments on AMD’s business and AMD’s ability to integrate acquired businesses, including ZT Systems; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain key employees; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.
1 Based on engineering projections by AMD Performance Labs in December 2025, to estimate the peak theoretical precision performance of AMD Instinct™ MI500 Series GPU powered AI Rack vs. an AMD Instinct MI300X platform. Results subject to change when products are released in market.
2 Trillions of Operations per Second (TOPS) for an AMD Ryzen processor is the maximum number of operations per second that can be executed in an optimal scenario and may not be typical. TOPS may vary based on several factors, including the specific system configuration, AI model, and software version. GD-243.
Contact:
Phil Hughes
AMD Communications
512-865-9697
phil.hughes@amd.com
Liz Stine
AMD Investor Relations
+1 720-652-3965
liz.stine@amd.com
